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Model RD38F1010C0ZTL0
Description 32Mbit, 3V advanced+boot block fflash memory (C3) stacked-chip scale package family, 70ns
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Brand: Intel
Packaging LFBGA
Delivery time
Packaging method
Standard packaging quantity 1
0yuan
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(1449) Minimum order quantity(1)
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Encapsulation parameters/Encapsulation: LFBGA

External dimensions/packaging: LFBGA

Other/Product Lifecycle: Obsolete

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适配器型号: DX5026 支持的编程器: SUPERPRO/6100N
适配器型号: DX5026 支持的编程器: SUPERPRO/6104N

Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
M36W832BE85ZA1T M36W832BE85ZA1T Numonyx 功能相似 LFBGA
Memory Circuit, 2MX16, PBGA66, 12 X 8MM, 0.8MM PITCH, LFBGA-66
PDF
RD28F1604C3BD70 RD28F1604C3BD70 Intel 功能相似 LFBGA
16Mbit, 3V advanced+boot block fflash memory (C3) stacked-chip scale package family,70ns
PDF

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