Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CD4508BE
|
TI | 功能相似 | DIP-24 |
TEXAS INSTRUMENTS CD4508BE 逻辑芯片, D型锁存器, 双路, 4位, 24DIP
|
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