Package parameters/number of pins: 96
Encapsulation parameters/Encapsulation: TFBGA
External dimensions/packaging: TFBGA
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
H5TQ2G63BFR-H9C
|
SK Hand Tool | 功能相似 | FBGA |
DRAM Chip DDR3 SDRAM 2G-Bit 128Mx16 1.5V 96Pin F-BGA
|
||
H5TQ2G63BFR-H9C
|
SK Hynix | 功能相似 | TFBGA |
DRAM Chip DDR3 SDRAM 2G-Bit 128Mx16 1.5V 96Pin F-BGA
|
||
H5TQ2G63DFR-RDC
|
SK Hynix | 完全替代 | TFBGA |
HYNIX SEMICONDUCTOR H5TQ2G63DFR-RDC 芯片, 存储器, SDRAM, DDR3, 2GB (X16), 96FBGA
|
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