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Model H5TQ2G63BFR-H9C
Description HYNIX SEMICONDUCTOR H5TQ2G63BFR-H9C Chip, Memory, SDRAM, DDR3, 2GB (X16), 96FBGA
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Brand: SK Hand Tool
Packaging FBGA
Delivery time
Packaging method Each
Standard packaging quantity 1
0yuan
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(4392) Minimum order quantity(1)
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Technical parameters/number of pins: 96

Technical parameters/access time: 13.5 ns

Technical parameters/operating temperature (Max): 85 ℃

Technical parameters/operating temperature (Min): 0 ℃

Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 96

Encapsulation parameters/Encapsulation: FBGA

External dimensions/packaging: FBGA

Other/Packaging Methods: Each

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standard/REACH SVHC version: 2016/06/20

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
H5TQ2G63BFR-H9C H5TQ2G63BFR-H9C SK Hand Tool 功能相似 FBGA
DRAM Chip DDR3 SDRAM 2G-Bit 128Mx16 1.5V 96Pin F-BGA
PDF
H5TQ2G63BFR-H9C H5TQ2G63BFR-H9C SK Hynix 功能相似 TFBGA
DRAM Chip DDR3 SDRAM 2G-Bit 128Mx16 1.5V 96Pin F-BGA
PDF
H5TQ2G63DFR-RDC H5TQ2G63DFR-RDC SK Hynix 完全替代 TFBGA
HYNIX SEMICONDUCTOR H5TQ2G63DFR-RDC 芯片, 存储器, SDRAM, DDR3, 2GB (X16), 96FBGA
PDF

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