Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tube, Rail
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74HC670N
|
NXP | 功能相似 | DIP |
Memory IC, CMOS, PDIP16
|
||
CD74HC670EE4
|
TI | 完全替代 | PDIP-16 |
高速CMOS逻辑4×4寄存器文件 High-Speed CMOS Logic 4x4 Register File
|
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