Chip AI consultant
Technical parameters/power supply voltage (DC): 2.00V (min)
Technical parameters/number of output interfaces: 4
Technical parameters/output current: 7.80 mA
Technical parameters/number of circuits: 2
Technical parameters/number of channels: 4
Technical parameters/digits: 4
Technical parameters/number of inputs: 4
Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -55 ℃
Technical parameters/power supply voltage: 2V ~ 6V
Technical parameters/power supply voltage (Max): 6 V
Technical parameters/power supply voltage (Min): 2 V
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: PDIP-16
External dimensions/length: 19.3 mm
External dimensions/width: 6.35 mm
External dimensions/height: 4.57 mm
External dimensions/packaging: PDIP-16
Physical parameters/operating temperature: -55℃ ~ 125℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CD54HC670F3A
|
TI | 完全替代 | DIP |
高速CMOS逻辑4×4寄存器文件 High-Speed CMOS Logic 4x4 Register File
|
||
CD54HC670F3A
|
Harris | 完全替代 | DIP |
高速CMOS逻辑4×4寄存器文件 High-Speed CMOS Logic 4x4 Register File
|
||
CD74HCT670E
|
TI | 类似代替 | PDIP-16 |
高速CMOS逻辑4×4寄存器文件 High-Speed CMOS Logic 4x4 Register File
|
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