Technical parameters/insulation resistance: 100 MΩ
Technical parameters/contact type: SPDT
Technical parameters/Contact resistance: 100 mΩ
Encapsulation parameters/installation method: Through Hole
External dimensions/height: 6.20 mm
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standard/REACH SVHC version: 2016/06/20
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SSM-001
|
Multicomp | 完全替代 | PBT (Polybutylene Terephthalate) |
MULTICOMP SSM-001 微动开关, SPDT, 焊接, 500 mA, 30 VDC
|
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