Technical parameters/Insulation resistance: | 100 MΩ |
|
Technical parameters/contact type: | SPDT |
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Technical parameters/Contact resistance: | 100 mΩ |
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Technical parameters/rated current (Max): | 0.5 A |
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Technical parameters/operating temperature (Max): | 70 ℃ |
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Technical parameters/operating temperature (Min): | -15 ℃ |
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Encapsulation parameters/installation method: | Through Hole |
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Encapsulation parameters/Encapsulation: | PBT (Polybutylene Terephthalate) |
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Dimensions/Height: | 6.2 mm |
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Dimensions/Packaging: | PBT (Polybutylene Terephthalate) |
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Physical parameters/contact material: | Silver Alloy |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standard/REACH SVHC version: | 2016/06/20 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SSM-002
|
Multicomp | 完全替代 |
MULTICOMP SSM-002 微动开关, SPDT, 焊接, 500 mA, 30 VDC
|
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