Technical parameters/dissipated power: 200 W
Technical parameters/operating temperature (Max): 150 ℃
Encapsulation parameters/installation method: Screw
Encapsulation parameters/Encapsulation: Half Bridge1
External dimensions/width: 34 mm
External dimensions/packaging: Half Bridge1
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BSM25GB120DN2
|
Infineon | 功能相似 | Half Bridge1 |
IGBT功率模块(半桥包括快速续流二极管封装用绝缘金属基板) IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate)
|
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BSM25GB120DN2
|
Siemens Semiconductor | 功能相似 |
IGBT功率模块(半桥包括快速续流二极管封装用绝缘金属基板) IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate)
|
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