Technical parameters/access time (Max): 25 ns
Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -55 ℃
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 28
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: Non-Compliant
Customs information/ECCN code: 3A001.a.2.c
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IDT7203L25TP
|
Integrated Device Technology | 类似代替 | DIP-28 |
CMOS异步FIFO 2048× 9 , 4096 ×9 , 8192 ×9和16384 ×9 CMOS ASYNCHRONOUS FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9
|
||
IDT7203L25TPI
|
Integrated Device Technology | 功能相似 | DIP |
IC MEM FIFO 2048X9 25NS 28-DIP
|
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