Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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Renesas Electronics | 功能相似 |
CMOS异步FIFO 2048 ×9 , 4096 ×9的8,192 ×9 , 16,384 ×9 CMOS ASYNCHRONOUS FIFO 2,048 x 9, 4,096 x 9 8,192 x 9, 16,384 x 9
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