Technical parameters/Contact electroplating: Gold
Technical parameters/insulation resistance: 1.00 GΩ
Technical parameters/Contact resistance: 6.00 mΩ
Technical parameters/number of plug and unplug cycles: 500
Encapsulation parameters/installation method: Through Hole
Physical parameters/contact material: Beryllium Copper
Physical parameters/insulation material: Teflon
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/REACH SVHC standards: No SVHC
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
1-1337481-0
|
Tyco Electronics | 类似代替 |
TE CONNECTIVITY / GREENPAR 1-1337481-0 射频/同轴连接器, SMB同轴, 直角插座, 焊接, 50 ohm, 黄铜
|
|||
24-14-2-TGG
|
Multicomp | 完全替代 |
MULTICOMP 24-14-2-TGG 射频/同轴连接器, SMB同轴, 直型插座, 焊接, 50 ohm, 铍铜
|
|||
SMB1252B1-3GT30G-50
|
Amphenol | 类似代替 | - |
AMPHENOL SMB1252B1-3GT30G-50 射频/同轴连接器, SMB同轴, 直角插座, 通孔安装 直角, 50 ohm, 黄铜
|
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