Technical parameters/Contact electroplating: Gold
Technical parameters/insulation resistance: 1.00 GΩ
Technical parameters/Contact resistance: 6.00 mΩ
Technical parameters/number of plug and unplug cycles: 500
Encapsulation parameters/installation method: Through Hole
External dimensions/height: 7.5 mm
Physical parameters/contact material: Beryllium Copper
Physical parameters/insulation material: Teflon
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/REACH SVHC standards: No SVHC
Compliant with standard/REACH SVHC version: 2015/12/17
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
24-12-2-TGG
|
Multicomp | 完全替代 |
MULTICOMP 24-12-2-TGG 射频/同轴连接器, SMB同轴, 直角插座, 焊接, 50 ohm, 铍铜
|
|||
903-415J-51P
|
Amphenol | 功能相似 | SMB |
AMPHENOL RF 903-415J-51P 连接器, SMB直同轴插口, PCB安装
|
||
903-499J-51P2
|
Amphenol | 功能相似 | SMB |
AMPHENOL RF 903-499J-51P2 连接器, SMB直同轴插口, 50Ω, PCB安装
|
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