Technical parameters/power supply current: 110 mA
Technical parameters/access time (Max): 120 ns
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 56
Encapsulation parameters/Encapsulation: TSOP
External dimensions/packaging: TSOP
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs Information/Hong Kong Import and Export License: NLR
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S29GL512P10TFIR10
|
Spansion | 功能相似 | TSOP-56 |
SPANSION S29GL512P10TFIR10 芯片, 闪存, 512MB, 100NS, 56-TSOP
|
||
S29GL512P10TFIR20
|
Spansion | 功能相似 | TSOP-56 |
SPANSION S29GL512P10TFIR20 芯片, 闪存存储器, 512MB, 100NS, 56-TSOP
|
||
S29GL512P11TFI020
|
Cypress Semiconductor | 完全替代 | TSOP-56 |
Flash Memory, NOR, 512Mbit, 64M x 8Bit / 32M x 16Bit, Parallel, TSOP, 56Pins
|
||
S29GL512P11TFI020
|
Spansion | 完全替代 | TSOP-56 |
Flash Memory, NOR, 512Mbit, 64M x 8Bit / 32M x 16Bit, Parallel, TSOP, 56Pins
|
||
S29GL512P12TFIV10
|
Spansion | 完全替代 | TSOP |
NOR Flash Parallel 3V/3.3V 512M-bit 64M x 8/32M x 16 120ns 56Pin TSOP Tray
|
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