Chip AI consultant
Technical parameters/power supply current: | 110 mA |
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Technical parameters/number of pins: | 56 |
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Technical parameters/digits: | 8, 16 |
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Technical parameters/access time: | 110 ns |
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Technical parameters/memory capacity: | 64000000 B |
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Technical parameters/access time (Max): | 110 ns |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/power supply voltage: | 3V, 3.3V |
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Technical parameters/power supply voltage (Max): | 3.6 V |
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Technical parameters/power supply voltage (Min): | 2.7 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 56 |
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Encapsulation parameters/Encapsulation: | TSOP-56 |
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Dimensions/Packaging: | TSOP-56 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ (TA) |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Tray |
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Other/Manufacturing Applications: | Computers & Computer Peripherals, Industrial, Communications & Networking, Consumer Electronics |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
S29GL512P10TFIR10
|
Spansion | 类似代替 | TSOP-56 |
SPANSION S29GL512P10TFIR10 芯片, 闪存, 512MB, 100NS, 56-TSOP
|
||
S29GL512P10TFIR20
|
Spansion | 类似代替 | TSOP-56 |
SPANSION S29GL512P10TFIR20 芯片, 闪存存储器, 512MB, 100NS, 56-TSOP
|
||
S29GL512S11TFI020
|
Spansion | 类似代替 | TSOP-56 |
SPANSION S29GL512S11TFI020 闪存, 512 Mbit, 32M x 16位, 并行, TSOP, 56 引脚
|
||
S29GL512S11TFI020
|
Cypress Semiconductor | 类似代替 | TSOP-56 |
SPANSION S29GL512S11TFI020 闪存, 512 Mbit, 32M x 16位, 并行, TSOP, 56 引脚
|
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