Technical parameters/Contact electroplating: Gold
Encapsulation parameters/installation method: Solder
Physical parameters/contact material: Beryllium Copper
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/REACH SVHC standards: No SVHC
Compliant with standard/REACH SVHC version: 2015/12/17
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
11 SMA-50-3-5/111NH
|
Huber & Suhner | 功能相似 |
HUBER & SUHNER 11 SMA-50-3-5/111NH 射频/同轴连接器, SMA同轴, 直型插头, 焊接, 50 ohm, RG58C, 铍铜
|
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11 SMA-50-3-5/111NH
|
Suhner | 功能相似 |
HUBER & SUHNER 11 SMA-50-3-5/111NH 射频/同轴连接器, SMA同轴, 直型插头, 焊接, 50 ohm, RG58C, 铍铜
|
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24 SMA-50-3-42/133NE
|
Huber & Suhner | 功能相似 |
HUBER & SUHNER 24 SMA-50-3-42/133NE 射频/同轴连接器, SMA同轴, 直型隔板安装插座, 焊接, 50 ohm, RG142, RG142B, RG223, 铍铜
|
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MC000983
|
Multicomp | 类似代替 |
MULTICOMP MC000983 射频/同轴连接器, SMA同轴, 直型插座, 焊接, 50 ohm, RG402, 铍铜
|
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