Technical parameters/Contact electroplating: Gold
Technical parameters/Contact resistance: 2.50 mΩ
Encapsulation parameters/installation method: Solder
Physical parameters/contact material: Beryllium Copper
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/REACH SVHC standards: No SVHC
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
21 SMA-50-3-5/111NE
|
Suhner | 功能相似 |
HUBER & SUHNER 21 SMA-50-3-5/111NE 射频/同轴连接器, SMA同轴, 直型插座, 焊接, 50 ohm, RG58C, 铍铜
|
|||
21 SMA-50-3-5/111NE
|
Huber & Suhner | 功能相似 |
HUBER & SUHNER 21 SMA-50-3-5/111NE 射频/同轴连接器, SMA同轴, 直型插座, 焊接, 50 ohm, RG58C, 铍铜
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review