Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -25 ℃
Package parameters/number of pins: 56
Encapsulation parameters/Encapsulation: BGA
External dimensions/height: 0.97 mm
External dimensions/packaging: BGA
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs Information/Hong Kong Import and Export License: NLR
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BF3
|
Spansion | 功能相似 | TFBGA |
Memory Circuit, 1MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56
|
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|
|
Spansion | 功能相似 | TFBGA |
Memory Circuit, 2MX16, CMOS, PBGA56, 7 X 9MM, 1.2MM HEIGHT, LEAD FREE, FBGA-56
|
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