Encapsulation parameters/Encapsulation: | TFBGA |
|
Dimensions/Packaging: | TFBGA |
|
Other/Product Lifecycle: | Obsolete |
|
Other/Packaging Methods: | Tray |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Customs Information/Hong Kong Import and Export License: | NLR |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BF3
|
Spansion | 功能相似 | TFBGA |
Memory Circuit, 1MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56
|
||
S71GL032N80BFW0P0
|
Spansion | 功能相似 | BGA |
Memory Circuit, 2MX16, CMOS, PBGA56, 7 X 9MM, 1.2MM HEIGHT, LEAD FREE, FBGA-56
|
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