Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: MicroSMD-4
External dimensions/packaging: MicroSMD-4
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
TI | 类似代替 | VFBGA |
音频功率放大器 LMV1015UR-15 DSBGA-4
|
||
|
|
National Semiconductor | 类似代替 | uSMD |
音频功率放大器 LMV1015UR-15 DSBGA-4
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review