Technical parameters/Static current: | 180 µA |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 4 |
|
Encapsulation parameters/Encapsulation: | VFBGA |
|
Dimensions/Packaging: | VFBGA |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Cut Tape (CT) |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: | Contains Lead |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LMV1015UR-15/NOPB
|
TI | 类似代替 | XFBGA-4 |
Audio Amp Microphone 1CH Mono Class-AB 4Pin uSMD T/R
|
||
LMV1015UR-15/NOPB
|
National Semiconductor | 类似代替 | MicroSMD-4 |
Audio Amp Microphone 1CH Mono Class-AB 4Pin uSMD T/R
|
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