Encapsulation parameters/Encapsulation: SOP
External dimensions/packaging: SOP
Other/Product Lifecycle: Unknown
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CLC5523IN
|
TI | 完全替代 | DIP |
可编程/可变增益放大器(PGA/VGA) CLC5523IN MDIP-8
|
||
CLC5523IN
|
National Semiconductor | 完全替代 | DIP-8 |
可编程/可变增益放大器(PGA/VGA) CLC5523IN MDIP-8
|
||
LMH6504MA/NOPB
|
National Semiconductor | 类似代替 | SOIC-8 |
运算放大器 LMH6504MA/NOPB SOIC-8
|
||
LMH6504MAX/NOPB
|
TI | 完全替代 | SOIC-8 |
可编程/可变增益放大器(PGA/VGA) LMH6504MAX/NOPB SOIC-8
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review