Technical parameters/dissipated power: 200 mW
Technical parameters/forward current (Max): 50 mA
Technical parameters/dissipated power (Max): 200 mW
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOD-323
External dimensions/packaging: SOD-323
Physical parameters/operating temperature: -65℃ ~ 150℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Secos | 功能相似 |
NXP BAP50-03 二极管, 射频/PIN, 单, 5 ohm, SOD-323, 2引脚
|
|||
BAP50-03
|
Micro Commercial Components | 功能相似 |
NXP BAP50-03 二极管, 射频/PIN, 单, 5 ohm, SOD-323, 2引脚
|
|||
BAP50-03
|
SHIKUES | 功能相似 | SHIKUES(时科) |
NXP BAP50-03 二极管, 射频/PIN, 单, 5 ohm, SOD-323, 2引脚
|
||
BAP50-03
|
Kexin | 功能相似 |
NXP BAP50-03 二极管, 射频/PIN, 单, 5 ohm, SOD-323, 2引脚
|
|||
BAP50-03,115
|
NXP | 功能相似 | SOD-323 |
NXP BAP50-03,115 PIN 二极管, Ifor=50mA, Vrev=50V, 2引脚 UMD封装
|
||
|
|
NXP | 类似代替 | SOD-323 |
DIODE SILICON, PIN DIODE, PLASTIC, SC-76, 2Pin, PIN Diode
|
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