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Model BAP50-03,115

Description NXP BAP50-03,115 PIN 二极管, Ifor=50mA, Vrev=50V, 2引脚 UMD封装

Brand: NXP

Packaging SOD-323

Delivery time

Packaging method Cut Tape (CT)

Standard packaging quantity 1

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Technical parameters/capacitance:	0.35 pF
Technical parameters/forward voltage:	1.1 V
Technical parameters/dissipated power:	0.5 W
Technical parameters/forward current:	50 mA
Technical parameters/breakdown voltage:	50 V
Technical parameters/forward voltage (Max):	1.1 V
Technical parameters/forward current (Max):	50 mA
Technical parameters/operating temperature (Max):	150 ℃
Technical parameters/operating temperature (Min):	-65 ℃
Technical parameters/dissipated power (Max):	500 mW
Technical parameters/rated voltage:	50 V
Encapsulation parameters/installation method:	Surface Mount
Package parameters/number of pins:	2
Encapsulation parameters/Encapsulation:	SOD-323
Dimensions/Length:	1.8 mm
Dimensions/Width:	1.35 mm
Dimensions/Height:	1.05 mm
Dimensions/Packaging:	SOD-323
Physical parameters/operating temperature:	-65℃ ~ 150℃ (TJ)
Other/Product Lifecycle:	Active
Other/Packaging Methods:	Cut Tape (CT)
Compliant with standards/RoHS standards:	RoHS Compliant
Compliant with standards/lead standards:	Lead Free
Compliant with standard/REACH SVHC version:	2015/12/17
Customs information/ECCN code:	EAR99

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BAP50-03T/R	NXP	类似代替	SOD-323	DIODE SILICON, PIN DIODE, PLASTIC, SC-76, 2Pin, PIN Diode	PDF