Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Unknown
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LM9061MX/NOPB
|
National Semiconductor | 功能相似 | SOIC |
7V 至 26V 高侧保护控制器 8-SOIC -40 to 125
|
||
LM9061MX/NOPB
|
TI | 功能相似 | SOIC-8 |
7V 至 26V 高侧保护控制器 8-SOIC -40 to 125
|
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