Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation: | SOIC |
|
Dimensions/Packaging: | SOIC |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | PB free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
National Semiconductor | 完全替代 | SOIC |
高边 MOSFET
|
||
LM9061MX/NOPB
|
National Semiconductor | 功能相似 | SOIC |
7V 至 26V 高侧保护控制器 8-SOIC -40 to 125
|
||
LM9061MX/NOPB
|
TI | 功能相似 | SOIC-8 |
7V 至 26V 高侧保护控制器 8-SOIC -40 to 125
|
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