Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: TO-262-3
External dimensions/packaging: TO-262-3
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IRF830ALPBF
|
International Rectifier | 功能相似 | TO-262 |
MOSFET N-CH 500V 5A TO262-3
|
||
IRF830ALPBF
|
Vishay Semiconductor | 功能相似 | TO-262 |
MOSFET N-CH 500V 5A TO262-3
|
||
IRF830ALPBF
|
VISHAY | 功能相似 | TO-262 |
MOSFET N-CH 500V 5A TO262-3
|
||
IRFSL9N60APBF
|
VISHAY | 类似代替 | TO-262-3 |
MOSFET N-CH 600V 9.2A TO-262
|
||
IRFSL9N60APBF
|
International Rectifier | 类似代替 | TO-262 |
MOSFET N-CH 600V 9.2A TO-262
|
||
IRFSL9N60APBF
|
Vishay Intertechnology | 类似代替 | TO-262 |
MOSFET N-CH 600V 9.2A TO-262
|
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