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Model CY7C1315BV18-200BZC
Description 18 - MbitThe QDR ™- II SRAM 4-Word Burst Architecture 18 Mbit QDR ⑩ - II SRAM 4-Word Burst Architecture
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Brand: Cypress Semiconductor
Packaging FBGA-165
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Standard packaging quantity 1
0yuan
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(8298) Minimum order quantity(1)
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Technical parameters/operating temperature (Max): 70 ℃

Technical parameters/operating temperature (Min): 0 ℃

Technical parameters/power supply voltage: 1.7V ~ 1.9V

Technical parameters/power supply voltage (Max): 1.9 V

Technical parameters/power supply voltage (Min): 1.7 V

Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 165

Encapsulation parameters/Encapsulation: FBGA-165

External dimensions/packaging: FBGA-165

Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)

Other/Product Lifecycle: Unknown

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards:

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
CY7C1315BV18-200BZXC CY7C1315BV18-200BZXC Cypress Semiconductor 完全替代 FBGA-165
18 - Mbit的QDR ™-II SRAM 4字突发架构 18-Mbit QDR⑩-II SRAM 4-Word Burst Architecture
PDF
CY7C1315CV18-200BZC CY7C1315CV18-200BZC Cypress Semiconductor 完全替代 FBGA-165
18 - Mbit的QDR ™-II SRAM 4字突发架构 18-Mbit QDR⑩-II SRAM 4-Word Burst Architecture
PDF

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