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Model CY7C12701KV18-400BZXC
Description SRAM Chip Sync Single 1.8V 36M-Bit 1M x 36 0.45ns 165Pin FBGA
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Brand: Cypress Semiconductor
Packaging LBGA-165
Delivery time
Packaging method Tray
Standard packaging quantity 1
0yuan
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(7985) Minimum order quantity(1)
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Technical parameters/power supply voltage: 1.7V ~ 1.9V

Package parameters/number of pins: 165

Encapsulation parameters/Encapsulation: LBGA-165

External dimensions/packaging: LBGA-165

Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)

Other/Product Lifecycle: Unknown

Other/Packaging Methods: Tray

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
CY7C12501KV18-400BZC CY7C12501KV18-400BZC Cypress Semiconductor 类似代替 FBGA-165
36兆位的DDR II + SRAM 2字突发架构（ 2.0周期读延迟） 36-Mbit DDR II+ SRAM 2-Word Burst Architecture (2.0 Cycle Read Latency)
PDF
CY7C12501KV18-400BZXC CY7C12501KV18-400BZXC Cypress Semiconductor 类似代替 FBGA-165
SRAM Chip Sync Single 1.8V 36M-Bit 1M x 36 0.45ns 165Pin FBGA Tray
PDF

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