Technical parameters/access time: 0.45 ns
Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 1.7V ~ 1.9V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 165
Encapsulation parameters/Encapsulation: FBGA-165
External dimensions/packaging: FBGA-165
Physical parameters/operating temperature: 0℃ ~ 70℃
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CY7C12501KV18-400BZC
|
Cypress Semiconductor | 类似代替 | FBGA-165 |
36兆位的DDR II + SRAM 2字突发架构( 2.0周期读延迟) 36-Mbit DDR II+ SRAM 2-Word Burst Architecture (2.0 Cycle Read Latency)
|
||
CY7C12501KV18-400BZXC
|
Cypress Semiconductor | 完全替代 | FBGA-165 |
SRAM Chip Sync Single 1.8V 36M-Bit 1M x 36 0.45ns 165Pin FBGA Tray
|
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