Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 4
Encapsulation parameters/Encapsulation: SOT-89
External dimensions/packaging: SOT-89
Other/Product Lifecycle: Unknown
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Philips | 类似代替 | SOT-89 |
NXP ### 双极性晶体管,NXP Semiconductors
|
||
BST62
|
Nexperia | 类似代替 | SOT-89 |
NXP ### 双极性晶体管,NXP Semiconductors
|
||
NTE2429
|
NTE Electronics | 类似代替 | SOT-89 |
SOT-89 PNP 1A
|
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