Technical parameters/minimum current amplification factor (hFE): 110
Technical parameters/Maximum current amplification factor (hFE): 800
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SC-70-6
External dimensions/packaging: SC-70-6
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BC847BPN
|
Philips | 类似代替 | SC-88 |
NXP BC847BPN 双极晶体管阵列, 通用, NPN, PNP, 45 V, 200 mW, 100 mA, 200 hFE, SC-88
|
||
BC847BPN
|
Nexperia | 类似代替 | SC-88 |
NXP BC847BPN 双极晶体管阵列, 通用, NPN, PNP, 45 V, 200 mW, 100 mA, 200 hFE, SC-88
|
||
BC847BS,115
|
NXP | 功能相似 | SOT-323-6 |
NXP BC847BS,115 双极晶体管阵列, 双NPN, 45 V, 220 mW, 100 mA, 200 hFE, SOT-363
|
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