Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: TO-236
External dimensions/packaging: TO-236
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BAV23S/DG
|
NXP | 功能相似 | SOT-23 |
DIODE 0.125 A, 250 V, 2 ELEMENT, SILICON, SIGNAL DIODE, TO-236AB, PLASTIC PACKAGE-3, Signal Diode
|
||
CMPD2003S
|
Central Semiconductor | 功能相似 | SOT-23 |
DIODE GEN PURP 200V 200mA SOT23
|
||
MMBD353LT1G
|
ON Semiconductor | 功能相似 | SOT-23-3 |
MMBD353LT1G 系列 7 V 10 uA 表面贴装 双 热载流子 混频器 二极管 - SOT-23-3
|
||
MMBD355LT1G
|
ON Semiconductor | 功能相似 | SOT-23-3 |
On Semiconductor RF(射频)二极管,适用于 HF、射频及微波混合和检测应用。 ### 标准 带 NSV- 或 S- 前缀的制造商部件号符合 AEC-Q101 汽车等级。 ### 二极管和整流器,ON Semiconductor
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