Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 1.14V ~ 1.575V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 324
Encapsulation parameters/Encapsulation: FBGA-324
External dimensions/length: 19 mm
External dimensions/width: 19 mm
External dimensions/height: 1.25 mm
External dimensions/packaging: FBGA-324
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
SOC | 完全替代 | BGA-324 |
FPGA ProASIC®3EL Family 3M Gates 892.86MHz 130nm (CMOS) Technology 1.2V 324Pin FBGA
|
||
A3PE3000L-1FGG324
|
Microsemi | 完全替代 | FBGA-324 |
FPGA ProASIC®3EL Family 3M Gates 892.86MHz 130nm (CMOS) Technology 1.2V 324Pin FBGA
|
||
|
|
SOC | 完全替代 | BGA-324 |
FPGA ProASIC®3EL Family 3M Gates 781.25MHz 130nm Technology 1.2V 324Pin FBGA
|
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