Technical parameters/power supply voltage: 1.14V ~ 1.575V
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: BGA-324
External dimensions/packaging: BGA-324
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
SOC | 完全替代 | BGA-324 |
FPGA ProASIC®3EL Family 3M Gates 892.86MHz 130nm (CMOS) Technology 1.2V 324Pin FBGA
|
||
A3PE3000L-1FGG324
|
Microsemi | 完全替代 | FBGA-324 |
FPGA ProASIC®3EL Family 3M Gates 892.86MHz 130nm (CMOS) Technology 1.2V 324Pin FBGA
|
||
|
|
SOC | 完全替代 | BGA-324 |
FPGA ProASIC®3EL Family 3M Gates 781.25MHz 130nm Technology 1.2V 324Pin FBGA
|
||
|
|
Microsemi | 完全替代 | FBGA-324 |
FPGA - 现场可编程门阵列 ProASIC3
|
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