Chip AI consultant
Technical parameters/access time: 10 ns
Technical parameters/power supply voltage: 3V ~ 3.6V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 64
Encapsulation parameters/Encapsulation: TQFP-64
External dimensions/packaging: TQFP-64
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
7285L15PAGI
|
Integrated Device Technology | 功能相似 | TFSOP-56 |
FIFO Mem Async Dual Depth/Width Uni-Dir 8K x 9 x 2 56Pin TSSOP Tube/Tray
|
||
72V85L15PAG
|
Integrated Device Technology | 功能相似 | TSSOP-56 |
3.3伏的CMOS双异步FIFO DUAL 512× 9 ，双1024× 9双2048 ×9 ，双4096 ×9 DUAL 8,192 ×9 3.3 Volt CMOS DUAL ASYNCHRONOUS FIFO DUAL 512 x 9, DUAL 1,024 x 9 DUAL 2,048 x 9, DUAL 4,096 X 9 DUAL 8,192 X 9
|
||
72V85L15PAG
|
Renesas Electronics | 功能相似 | TFSOP-56 |
3.3伏的CMOS双异步FIFO DUAL 512× 9 ，双1024× 9双2048 ×9 ，双4096 ×9 DUAL 8,192 ×9 3.3 Volt CMOS DUAL ASYNCHRONOUS FIFO DUAL 512 x 9, DUAL 1,024 x 9 DUAL 2,048 x 9, DUAL 4,096 X 9 DUAL 8,192 X 9
|
||
IDT72V285L15PFI
|
Integrated Device Technology | 功能相似 | LQFP |
3.3伏的CMOS SuperSync FIFO 3.3 VOLT CMOS SuperSync FIFO
|
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