Chip AI consultant
Encapsulation parameters/installation method: | Surface Mount |
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Encapsulation parameters/Encapsulation: | LQFP |
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Dimensions/Packaging: | LQFP |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Tray |
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Compliant with standards/RoHS standards: | Non-Compliant |
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Compliant with standards/lead standards: | Contains Lead |
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Customs information/ECCN code: | EAR99 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
7285L15PAGI
|
Integrated Device Technology | 功能相似 | TFSOP-56 |
FIFO Mem Async Dual Depth/Width Uni-Dir 8K x 9 x 2 56Pin TSSOP Tube/Tray
|
||
72V85L15PAG
|
Integrated Device Technology | 功能相似 | TSSOP-56 |
3.3伏的CMOS双异步FIFO DUAL 512× 9 ，双1024× 9双2048 ×9 ，双4096 ×9 DUAL 8,192 ×9 3.3 Volt CMOS DUAL ASYNCHRONOUS FIFO DUAL 512 x 9, DUAL 1,024 x 9 DUAL 2,048 x 9, DUAL 4,096 X 9 DUAL 8,192 X 9
|
||
72V85L15PAG
|
Renesas Electronics | 功能相似 | TFSOP-56 |
3.3伏的CMOS双异步FIFO DUAL 512× 9 ，双1024× 9双2048 ×9 ，双4096 ×9 DUAL 8,192 ×9 3.3 Volt CMOS DUAL ASYNCHRONOUS FIFO DUAL 512 x 9, DUAL 1,024 x 9 DUAL 2,048 x 9, DUAL 4,096 X 9 DUAL 8,192 X 9
|
||
72V85L15PAG8
|
Integrated Device Technology | 功能相似 | TSSOP-56 |
Bi-Directional FIFO, 8KX9, 15ns, Asynchronous, CMOS, PDSO56, GREEN, TSSOP-56
|
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