Technical parameters/access time: 5 ns
Technical parameters/power supply voltage: 3.15V ~ 3.45V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 144
Encapsulation parameters/Encapsulation: BGA-144
External dimensions/length: 13 mm
External dimensions/width: 13 mm
External dimensions/height: 1.76 mm
External dimensions/packaging: BGA-144
External dimensions/thickness: 1.76 mm
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Renesas Electronics | 类似代替 | BGA-144 |
FIFO Mem Sync Dual Depth/Width Uni-Dir 128K x 36 144Pin BGA
|
||
72V36110L6BB
|
Integrated Device Technology | 类似代替 | BGA-144 |
FIFO Mem Sync Dual Depth/Width Uni-Dir 128K x 36 144Pin BGA
|
||
72V36110L6BBG
|
Integrated Device Technology | 类似代替 | BGA-144 |
先进先出 128Kx36 3.3V SUPER SYNC II 先进先出
|
||
|
|
Renesas Electronics | 完全替代 | PBGA-144 |
先进先出 128Kx36 3.3V SUPER SYNC II 先进先出
|
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