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Model 72V36110L6BB
Description FIFO Mem Sync Dual Depth/Width Uni-Dir 128K x 36 144Pin BGA
Product QR code
Brand: Integrated Device Technology
Packaging BGA-144
Delivery time
Packaging method Tray
Standard packaging quantity 1
1049.07  yuan 1049.07yuan
1+:
$ 1153.9770
10+:
$ 1143.4863
25+:
$ 1138.2410
50+:
$ 1132.9956
100+:
$ 1127.7503
150+:
$ 1122.5049
250+:
$ 1117.2596
500+:
$ 1112.0142
Quantity
1+
10+
25+
50+
100+
Price
$1153.9770
$1143.4863
$1138.2410
$1132.9956
$1127.7503
Price $ 1153.9770 $ 1143.4863 $ 1138.2410 $ 1132.9956 $ 1127.7503
Start batch production 1+ 10+ 25+ 50+ 100+
Check the distribution price
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(1646) Minimum order quantity(1)
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Technical parameters/access time: 4 ns

Technical parameters/power supply voltage: 3.15V ~ 3.45V

Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 144

Encapsulation parameters/Encapsulation: BGA-144

External dimensions/length: 13.0 mm

External dimensions/width: 13.0 mm

External dimensions/packaging: BGA-144

External dimensions/thickness: 1.76 mm

Physical parameters/operating temperature: 0℃ ~ 70℃

Other/Product Lifecycle: Active

Other/Packaging Methods: Tray

Compliant with standards/RoHS standards: Non-Compliant

Compliant with standards/lead standards: Contains Lead

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
72V36110L6BB8 72V36110L6BB8 Renesas Electronics 完全替代 BGA-144
IC FIFO SYNC 131KX36 6NS 144BGA
PDF
72V36110L6BBG 72V36110L6BBG Integrated Device Technology 完全替代 BGA-144
先进先出 128Kx36 3.3V SUPER SYNC II 先进先出
PDF

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