Technical parameters/access time: 25 ns
Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 4.5V ~ 5.5V
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 24
Encapsulation parameters/Encapsulation: DIP-24
External dimensions/length: 31.75 mm
External dimensions/width: 7.62 mm
External dimensions/height: 3.3 mm
External dimensions/packaging: DIP-24
External dimensions/thickness: 3.30 mm
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IDT6116LA35TP
|
Integrated Device Technology | 完全替代 | DIP-24 |
CMOS静态RAM 16K ( 2K ×8位) CMOS STATIC RAM 16K (2K x 8 BIT)
|
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