Technical parameters/frequency: 250 MHz
Technical parameters/rated voltage (DC): 40.0 V
Technical parameters/rated current: 1.00 A
Technical parameters/polarity: NPN
Technical parameters/dissipated power: 0.6 W
Technical parameters/breakdown voltage (collector emitter): 40 V
Technical parameters/minimum current amplification factor (hFE): 100 @150mA, 1V
Technical parameters/rated power (Max): 600 mW
Technical parameters/operating temperature (Max): 150 ℃
Technical parameters/operating temperature (Min): -55 ℃
Technical parameters/dissipated power (Max): 600 mW
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: TO-226-3
External dimensions/packaging: TO-226-3
Physical parameters/materials: Silicon
Physical parameters/operating temperature: -55℃ ~ 150℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Cut Tape (CT), Tape & Box (TB)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: EAR99
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
2N4401BU
|
Fairchild | 功能相似 | TO-226-3 |
FAIRCHILD SEMICONDUCTOR 2N4401BU 单晶体管 双极, NPN, 40 V, 250 MHz, 625 mW, 600 mA, 100 hFE
|
||
2N4401BU
|
ON Semiconductor | 功能相似 | TO-92-3 |
FAIRCHILD SEMICONDUCTOR 2N4401BU 单晶体管 双极, NPN, 40 V, 250 MHz, 625 mW, 600 mA, 100 hFE
|
||
2N4401TA
|
ON Semiconductor | 功能相似 | TO-92-3 |
FAIRCHILD SEMICONDUCTOR 2N4401TA 单晶体管 双极, NPN, 40 V, 250 MHz, 625 mW, 20 hFE
|
||
2N4401TA
|
Fairchild | 功能相似 | TO-226-3 |
FAIRCHILD SEMICONDUCTOR 2N4401TA 单晶体管 双极, NPN, 40 V, 250 MHz, 625 mW, 20 hFE
|
||
2N4401TAR
|
Fairchild | 功能相似 | TO-92-3 |
NPN 晶体管，40V 至 50V，Fairchild Semiconductor ### 双极晶体管，Fairchild Semiconductor 双极性结点晶体管 (BJT) 板系列提供完整的解决方案，用于满足各种电路应用需求。 创新的封装设计用于提供最小尺寸、最高可靠性和最大热性能。
|
||
2N4401TAR
|
ON Semiconductor | 功能相似 | TO-92-3 |
NPN 晶体管，40V 至 50V，Fairchild Semiconductor ### 双极晶体管，Fairchild Semiconductor 双极性结点晶体管 (BJT) 板系列提供完整的解决方案，用于满足各种电路应用需求。 创新的封装设计用于提供最小尺寸、最高可靠性和最大热性能。
|
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