Technical parameters/RAM size: 290303 B
Technical parameters/number of logic gates: 3400000
Technical parameters/power supply voltage: 1.14V ~ 1.26V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 676
Encapsulation parameters/Encapsulation: FBGA-676
External dimensions/packaging: FBGA-676
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Each
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/REACH SVHC standards: No SVHC
Customs information/ECCN code: 3A001.a.7.a
Customs Information/Hong Kong Import and Export License: NLR
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC3SD3400A-4FG676I
|
Xilinx | 完全替代 | FBGA-676 |
XC3SD3400A 4FG676I 磨码
|
||
XC3SD3400A-4FGG676I
|
Xilinx | 完全替代 | FBGA-676 |
XC3SD3400A 4FGG676I 磨码
|
||
XC3SD3400A-5FG676C
|
Xilinx | 类似代替 | BGA-676 |
XC3SD3400A 5FG676C 磨码
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review