Technical parameters/power supply voltage: 1.14V ~ 1.26V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 676
Encapsulation parameters/Encapsulation: FBGA-676
External dimensions/packaging: FBGA-676
Physical parameters/operating temperature: -40℃ ~ 100℃
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs Information/Hong Kong Import and Export License: NLR
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC3SD3400A-4FG676I
|
Xilinx | 类似代替 | FBGA-676 |
XC3SD3400A 4FG676I 磨码
|
||
XC3SD3400A-4FGG676C
|
Xilinx | 完全替代 | FBGA-676 |
XC3SD3400A 4FGG676C 磨码
|
||
XC3SD3400A-4FGG676I
|
Xilinx | 完全替代 | FBGA-676 |
XC3SD3400A 4FGG676I 磨码
|
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