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Model XC3S5000-5FGG676C
Description XC3S5000 5FGG676C Grinding code
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Brand: Xilinx
Packaging FBGA-676
Delivery time
Packaging method
Standard packaging quantity 1
10292.09  yuan 10292.09yuan
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(4770) Minimum order quantity(1)
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Technical parameters/power supply voltage: 1.14V ~ 1.26V

Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 676

Encapsulation parameters/Encapsulation: FBGA-676

External dimensions/packaging: FBGA-676

Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)

Other/Product Lifecycle: Active

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

Customs information/ECCN code: 3A001.a.7.a

Customs Information/Hong Kong Import and Export License: NLR

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
XC3S2000-4FGG676I XC3S2000-4FGG676I Xilinx 完全替代 FBGA-676
XC3S2000-4FGG676I, Spartan-3系列 FPGA, 46080逻辑单元, 2000000逻辑门, 327680bitRAM , 46080逻辑块, 1.14 → 1.26 V, 676针 FBGA封装
PDF
XC3S4000-4FGG676C XC3S4000-4FGG676C Xilinx 完全替代 FBGA-676
XC3S4000-4FGG676C 磨码
XC3S5000-5FGG676C XC3S5000-5FGG676C Xilinx 完全替代 FBGA-676
XC3S5000 5FGG676C 磨码
PDF

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