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Model XC3S4000-4FGG676C
Description XC3S4000-4FGG676C Grinding code
Product QR code
Brand: Xilinx
Packaging FBGA-676
Delivery time
Packaging method
Standard packaging quantity 1
1140.77  yuan 1140.77yuan
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(1202) Minimum order quantity(1)
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Technical parameters/frequency:

630 MHz

 

Technical parameters/RAM size:

221183 B

 

Technical parameters/number of logic gates:

4000000

 

Technical parameters/power supply voltage:

1.14V ~ 1.26V

 

Encapsulation parameters/installation method:

Surface Mount

 

Package parameters/number of pins:

676

 

Encapsulation parameters/Encapsulation:

FBGA-676

 

Dimensions/Packaging:

FBGA-676

 

Physical parameters/operating temperature:

0℃ ~ 85℃

 

Other/Product Lifecycle:

Active

 

Compliant with standards/RoHS standards:

RoHS Compliant

 

Compliant with standards/lead standards:

Lead Free

 

Customs information/ECCN code:

3A001.a.7

 

Customs Information/Hong Kong Import and Export License:

NLR

 

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
XC3S2000-4FGG676I XC3S2000-4FGG676I Xilinx 完全替代 FBGA-676
XC3S2000-4FGG676I, Spartan-3系列 FPGA, 46080逻辑单元, 2000000逻辑门, 327680bitRAM , 46080逻辑块, 1.14 → 1.26 V, 676针 FBGA封装
PDF
XC3S5000-5FGG676C XC3S5000-5FGG676C Xilinx 完全替代 FBGA-676
XC3S5000 5FGG676C 磨码
PDF

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