Technical parameters/power supply voltage: 1.14V ~ 1.26V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 668
Encapsulation parameters/Encapsulation: BBGA-668
External dimensions/packaging: BBGA-668
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC4VLX25-10FF668I
|
Xilinx | 完全替代 | FCBGA-668 |
XC4VLX25 10FF668I 磨码
|
||
|
|
TI | 完全替代 |
XC4VLX25 11FFG668C 磨码
|
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