Technical parameters/power supply voltage: | 1.14V ~ 1.26V |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 668 |
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Encapsulation parameters/Encapsulation: | FCBGA-668 |
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Dimensions/Packaging: | FCBGA-668 |
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Physical parameters/operating temperature: | -40℃ ~ 100℃ |
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Other/Product Lifecycle: | Active |
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Compliant with standards/RoHS standards: | Non-Compliant |
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Compliant with standards/lead standards: | Contains Lead |
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Customs information/ECCN code: | 3A001.a.7.a |
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Customs Information/Hong Kong Import and Export License: | NLR |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Xilinx | 完全替代 | BBGA-668 |
XC4VLX25 11FF668C 磨码
|
||
|
|
TI | 完全替代 |
XC4VLX25 11FFG668C 磨码
|
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