Technical parameters/power supply voltage: 1.8 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 324
Encapsulation parameters/Encapsulation: BBGA-324
External dimensions/packaging: BBGA-324
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC2C384-10FGG324C
|
Xilinx | 完全替代 | BBGA-324 |
XC2C384 10FGG324C 磨码
|
||
XC2C384-7FGG324C
|
Xilinx | 完全替代 | BBGA-324 |
XC2C384 7FGG324C 磨码
|
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