Technical parameters/frequency: | 217 MHz |
|
Technical parameters/power supply voltage (DC): | 1.80 V |
|
Technical parameters/operating temperature (Max): | 70 ℃ |
|
Technical parameters/operating temperature (Min): | 0 ℃ |
|
Technical parameters/power supply voltage: | 1.8 V |
|
Technical parameters/power supply voltage (Max): | 1.9 V |
|
Technical parameters/power supply voltage (Min): | 1.7 V |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 324 |
|
Encapsulation parameters/Encapsulation: | BBGA-324 |
|
Dimensions/Packaging: | BBGA-324 |
|
Physical parameters/operating temperature: | 0℃ ~ 70℃ |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tray |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
Compliant with the REACH SVHC standard: | No SVHC |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
XC2C384-10FGG324I
|
Xilinx | 完全替代 | BBGA-324 |
XC2C384 10FGG324I 磨码
|
||
XC2C384-7FGG324C
|
Xilinx | 完全替代 | BBGA-324 |
XC2C384 7FGG324C 磨码
|
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