Technical parameters/power supply voltage: 2.7V ~ 3.6V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: WDFN-8
External dimensions/packaging: WDFN-8
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
W25Q64FVSSIG
|
Winbond Electronics | 类似代替 | SOIC-8 |
64-Mbit(8M x 8bit),SPI接口,工作电压:2.7V to 3.6V
|
||
W25Q64FVZPIG
|
Winbond Electronics | 完全替代 | WDFN-8 |
Flash Serial-SPI 3V 64Mbit 16M 1Bit 7ns 8Pin SOIC
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review